MediaTek Dimensity 8300 To Launch on November 21; Specs Leaked
The semiconductor manufacturer MediaTek has made an official announcement about the launch date for its upcoming MediaTek Dimensity 8000 series chipset. The sub-premium MediaTek Dimensity 8300 has been confirmed to be launching this month on November 21st, 2023.
To recall, a couple of weeks ago, before the Dimensity 9300 debut, this chipset was speculated to be coming alongside the MediaTek Dimensity 9300.
By courtesy of a tech tipster, the news of Dimensity 8300 coming has collaborated with rumours covering about possible specifications of the chipset.
Table of Contents
As per rumours, the Dimensity 8300 will adopt a 1+3+4 tri-cluster design. Just like its predecessor, this sub-premium processor is reportedly manufactured using a TSMC 4nm process.
Its octa-core CPU will feature a 1 Cortex-X3 high-performance core running at 2.8GHz, 3 Cortex-A715 performance cores ticking at 2.4GHz and 4 Cortex-A510 efficiency cores clocking at 1.6GHz. The SoC is said to integrate a G520 MC6 GPU with a frequency of 850MHz.
MediaTek Dimensity 8300 Phones
The Dimensity 8300, a sequel to the Dimensity 8200, is expected to fuel a large number of upper-tier midrange smartphones launching this quarter to the next quarters of 2024. So far, based on rumours, we expect to experience it and judge how good it is compared to its predecessor and even Qualcomm’s Snapdragon 7 Gen 3 processor in the upcoming Xiaomi Redmi K70E.
